Compare LS032B7DD02
Size (inch)
3.20
Size (cm)
8.00
Manufacturer
Sharp
Resolution
336 x 536 Pixel
Operating temp. (low to high)
-20 °C to 70 °C
Standby consumption
30
Operating consumption
250
Outline dimensions horizontal
47.00 mm
Outline dimensions vertical
76.30 mm
Outline dimensions depth
0.70 mm
Active area
42.67 x 68.07 mm
Display mode
Transflective
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Compare TP-4256S2F0
Manufacturer
DMC
Size (inch)
15.60
Size (cm)
39.60
Touch technology
PCAP
Operating temp. (low to high)
-40 °C to 80 °C
Touch interfaces - I2C
YES
Touch interfaces - USB
YES
Touch interfaces - UART
NO
Touch interfaces - SPI
NO
Thickness coverglass (mm)
w/o
Tail type
Passive
Outline dimensions horizontal
362.00 mm
Outline dimensions vertical
213.70 mm
Outline dimensions depth
2.40 mm
Active area
344.20 x 193.50 mm
Glass surface
w/o
Glass printed
NO
Incl. tape
NO
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Compare T084S-5RB004N-0A18R0-150FH
Manufacturer
Higgstec
Size (inch)
8.40
Size (cm)
21.30
Touch technology
Resistiv
Operating temp. (low to high)
-10 °C to 70 °C
Touch interfaces - I2C
NO
Touch interfaces - USB
NO
Touch interfaces - UART
NO
Touch interfaces - SPI
NO
Thickness coverglass (mm)
w/o
Tail type
Passive
Outline dimensions horizontal
186.90 mm
Outline dimensions vertical
142.30 mm
Outline dimensions depth
2.20 mm
Active area
171.40 x 128.80 mm
Glass surface
AG
Glass printed
NO
Incl. tape
NO
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Compare COM35H3R07ULC
Size (inch)
3.50
Size (cm)
8.90
Manufacturer
ORTUSTECH
Resolution
640 x 960 Pixel
Format
wide
Aspect ratio
5:3
Typical brightness
400 cd/m²
Contrast ratio typ.
700
Viewing angle
80/80/80/80
LCD technology
VA
Operating temp. (low to high)
-20 °C to 70 °C
Interface
MIPI
Outline dimensions horizontal
54.60 mm
Outline dimensions vertical
83.70 mm
Outline dimensions depth
2.60 mm
Active area
48.76 x 73.15 mm
Min. backlight lifetime
500000 hrs
Display technology
Blanview
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Compare MS-98J8, 3.5" SBC PicoCoreMX8MP
Manufacturer
MSI
F&S
Product type
SBC
COM
Formfactor
3,5 Zoll
PicoCore
Architecture
x86
ARM
CPU
Apollo Lake
NXP i.MX 8M Plus
Chipset io hub
integrated
integrated
Memory (on board)
max. 8 GByte DDR3L
8 GByte LPDDR4
Flash
32 GB eMMC
Operating temp. (low to high)
-10 °C to 60 °C
0 °C to 70 °C
LVDS
up to 3
MIPI/CSI
up to 2
MIPI/DSI
up to 1
Ethernet
up to 2
USB 2.0
up to 1
USB 3.0/3.1
up to 1
CAN
up to 2
UART
up to 4
USB-OTG
up to 2
Outline dimensions horizontal
40.00 mm
Outline dimensions vertical
35.00 mm
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