Participation in Embedded World 2023 in China

Visit us at this year's Embedded World in China, which will take place from 14 to 16 June at the Shanghai World Expo Exhibition & Convention Center.

Visit us at our booth #A001 in Hall 3 and experience our highlight products up close.

The eDM-SBC-iMX8Mmini features a best-cost design and can be operated with almost any panel thanks to its unique mezzanine module. All modular aspects of the board can be customized or modified to ensure easy integration and flexible use.

Our i.MX8MPlus based Single Board Computer (SBC) offers outstanding performance and is ideal for various AI applications. Despite its compact form factor, a wide range of interfaces are already supported on-board and can be extended via add-on modules according to customer requirements. The iMX8MPlus is available in different variants and enables easy scalability.

Our compact SMARC 2.1 module, the eDM-SMX-EL, supports the new processor generation Intel Atom® x6000E, Pentium® and Celeron® N & J series (codename Elkhart Lake). It offers improved graphics performance and can support three independent displays with a resolution of up to 4Kp60. The module is ideal for graphics-intensive low-power IoT applications and offers increased CPU performance, enhanced graphics performance and an excellent performance/watt ratio.
The universal carrier board eDM-CB-SM-IPCS is compatible with Intel's latest Atom® x6000E, Celeron® and Pentium® processor platforms ("Elkhart Lake") as well as future x86 generations and ARM platforms. The board offers high scalability and flexibility thanks to the SMARC standard. It comes in a thin mini-ITX format and allows customised designs with easy addition or removal of features.

We look forward to seeing you at our stand!