Produktkatalog: CPU Boards
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178 Ergebnisse
eDM-SMX-EL
NEW
Hersteller
Data Modul
Produkt-Typ
COM
Formfaktor
SMARC
Architektur
x86
CPU
Intel Atom x6000E, Celeron and
Display interfaces
up to 1 x eDP, up to 1 x HDMI, up to 1 x LVDS, up to 1 x MIPI/DSI, up to 2 x DP
I/O interfaces
up to 2 x Ethernet, up to 4 x USB 2.0, up to 2 x USB 3.0/3.1, up to 2 x CAN, up to 4 x UART
Außenmaße (H→ x V↑)
82,0 x 50,0 mm
conga-TC670
NEW
Hersteller
Congatec
Produkt-Typ
COM
Formfaktor
COM Express Compact
Architektur
x86
CPU
12th Gen Intel Core
Display interfaces
up to 1 x eDP, up to 1 x LVDS
I/O interfaces
up to 1 x Ethernet, up to 4 x USB 2.0, up to 8 x USB 3.0/3.1, up to 1 x CAN, up to 2 x UART
Außenmaße (H→ x V↑)
95,0 x 95,0 mm
conga-TC570r
NEW
Hersteller
Congatec
Produkt-Typ
COM
Formfaktor
COM Express Compact
Architektur
x86
CPU
11th Gen Intel Core
Display interfaces
up to 1 x eDP, up to 3 x DP
I/O interfaces
up to 1 x Ethernet, up to 8 x USB 2.0, up to 4 x USB 3.0/3.1, up to 2 x UART
Außenmaße (H→ x V↑)
95,0 x 95,0 mm
conga-TCV2
NEW
Hersteller
Congatec
Produkt-Typ
COM
Formfaktor
COM Express Compact
Architektur
x86
CPU
AMD Embedded Ryzen V2000
Display interfaces
up to 1 x eDP, up to 1 x LVDS, up to 3 x DP
I/O interfaces
up to 1 x Ethernet, up to 8 x USB 2.0, up to 4 x USB 3.0/3.1, up to 2 x UART
Außenmaße (H→ x V↑)
95,0 x 95,0 mm
conga-TCA7
NEW
Hersteller
Congatec
Produkt-Typ
COM
Formfaktor
COM Express Compact
Architektur
x86
CPU
Intel Atom x6000E
Display interfaces
up to 1 x eDP, up to 1 x LVDS
I/O interfaces
up to 2 x Ethernet, up to 8 x USB 2.0, up to 2 x USB 3.0/3.1, up to 1 x CAN, up to 2 x UART
Außenmaße (H→ x V↑)
95,0 x 95,0 mm
conga-TC675
NEW
Hersteller
Congatec
Produkt-Typ
COM
Formfaktor
COM Express Compact
Architektur
x86
CPU
13th Gen Intel Core
Display interfaces
up to 1 x eDP, up to 1 x LVDS
I/O interfaces
up to 1 x Ethernet, up to 8 x USB 2.0, up to 4 x USB 3.0/3.1, up to 1 x CAN, up to 2 x UART
Außenmaße (H→ x V↑)
95,0 x 95,0 mm
