Technische Daten
ID
12065277
Hersteller
F&S
Produkt-Typ
COM
Formfaktor
Proprietary
Architektur
ARM
CPU
i.MX 8ULP
Chipset io hub
integrated
Speicher
2 GByte LPDDR4
Flash
64 GB eMMC
MIPI/CSI
up to 1
MIPI/DSI
up to 1
Ethernet
up to 1
USB 2.0
up to 2
CAN
up to 1
UART
up to 8
Außenmaße (H→ x V↑)
35,0 x 35,0 mm
Downloads
SolderCore8ULP-A4-Englisch (479.1 KB)
SolderCore8ULP Hardware eng (447.97 KB)
Zubehör & Services
Zubehör
- Cooling solutions
- Cables
- Memory (on board)
- HDD/SSD
- Expansion modules
- Carrier boards and baseboards
Dienste
- Operating system support
- Embedded computing design