| Vergleichen | conga-TEVAL/COMe 3.0 |
| Hersteller |
Congatec
|
| Produkt-Typ |
Carrierboard
|
| Formfaktor |
Proprietary
|
| Architektur |
x86
|
| CPU |
n.a.
|
| Chipset io hub |
n.a.
|
| Speicher |
n.a.
|
| Flash |
n.a.
|
| Betriebstemperatur (niedrig bis hoch) | |
| eDP |
up to 1
|
| LVDS |
up to 1
|
| DP |
up to 3
|
| Ethernet |
up to 1
|
| USB 2.0 |
up to 2
|
| USB 3.0/3.1 |
up to 4
|
| CAN |
up to 1
|
| RS232 |
up to 1
|
| RS422 |
up to 1
|
| RS485 |
up to 1
|
| Außenmaße horizontal |
294,00 mm
|
| Außenmaße vertikal |
244,00 mm
|
