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Compare conga-SA7 SolderCoreMX8ULP OSM-S Module based on i.MX8Mm efusMX8X
Manufacturer
Congatec
F&S
F&S
F&S
Product type
COM
COM
COM
COM
Formfactor
SMARC
Proprietary
OSM-S
efus
Architecture
x86
ARM
ARM
ARM
CPU
Intel Atom x6000E
i.MX 8ULP
i.MX 8M Mini Quad
i.MX 8DualX
Chipset io hub
integrated
integrated
Memory (on board)
16 GByte LPDDR4x
2 GByte LPDDR4
8 GByte LPDDR4
512MB QSPI NAND
Flash
128 GByte eMMC
64 GB eMMC
64 GB eMMC
64 GB eMMC
Operating temp. (low to high)
-40 °C to 85 °C
-40 °C to 85 °C
-40 °C to 85 °C
0 °C to 70 °C
LVDS
up to 1
up to 2
MIPI/CSI
up to 1
up to 1
MIPI/DSI
up to 1
up to 1
up to 2
Ethernet
up to 4
up to 1
up to 2
USB 2.0
up to 6
up to 2
up to 1
USB 3.0/3.1
up to 2
up to 1
CAN
up to 2
up to 1
up to 2
UART
up to 4
up to 8
up to 4
USB-OTG
up to 2
Outline dimensions horizontal
82.00 mm
35.00 mm
30.00 mm
62.10 mm
Outline dimensions vertical
50.00 mm
35.00 mm
30.00 mm
47.00 mm
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