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Cpu-Boards(1)

Compare	conga-HPC/mRLP
Manufacturer	Congatec
Product type	COM
Formfactor	COM-HPC Client
Architecture	x86
CPU	13th Gen Intel Core
Memory (on board)	max. 64 GB DDR5
Flash	optional NVMe SSD
Operating temp. (low to high)	-40 °C to 85 °C
Outline dimensions horizontal	95.00 mm
Outline dimensions vertical	70.00 mm
	Request info/quote Request info/quote For this product you can select following accessories and services: Accessories Cooling solutions Cables Memory (on board) HDD/SSD Expansion modules Carrier boards and baseboards Services Operating system support Embedded computing design Leave this field blank