Our partner congatec presents the latest Computer-on-Modules (COMs) with 13th generation Intel Core processors. These modules offer impressive performance and are fully compatible with their predecessors. With Thunderbolt, USB 3.2 ports and advanced PCIe support up to Gen5, the COM-HPC modules enable increased data throughput, improved I/O bandwidth and higher power density. The COM Express 3.1 compliant modules offer upgrade options with PCIe Gen4 support and facilitate mass production of OEM designs. Compared to the previous generation, the 13th generation Intel Core processors offer up to 8% more single-thread and up to 5% more multi-thread performance. Selected models also support DDR5 memory and PCIe Gen5 connectivity. The integrated Intel Iris Xe graphics architecture with up to 80 execution units enables a wide range of applications in industry, medicine and AI. These COMs offer an outstanding platform for high-end embedded computers and open up new possibilities in embedded and edge computing applications.
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