Innovator of the Year with hybrid bonding

Innovator of the Year with hybrid bonding

In November 2020, we received the “Innovator of the Year” award for hybrid bonding in the category Optoelectronics / Display by the well-known German trade magazine Design & Elektronik. Innovative products and technologies were presented in a total of 13 different categories, from which the readership could choose their favorites.

As one of the first companies in Europe, we offer the fully automated hybrid bonding process at our production site in Weikersheim / Germany. Hybrid bonding is a further developed combination of the two classic bonding methods LOCA (liquid) and OCA (dry lamination) and represents a particularly economical method for high-volume touch projects.

More info about our bonding methods

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DATA MODUL Inc. - Headquarters
Location address

275 Marcus Blvd
Unit R
Hauppauge, NY 11788
United States

Phone: +1 (631) 951-0800


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