Timeline Category
Milestone
Timline Text

The LOCA process was the first optical bonding process to be implemented in the production processes in 2012. The LOCA process is used to bond glass/glass or glass/film/film-based PCAP sensors. The LOCA process is now one of the most common and most established technologies and is particularly suited for bonding hard materials such as glass, plastic and TFT panels.

Timeline Media
first LOCA bonding machine
Contact
DATA MODUL Inc. - Headquarters
Location address

275 Marcus Blvd
Unit R
Hauppauge, NY 11788
United States

Phone: +1 (631) 951-0800

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