conga-TEVAL/COMe 3.0

Technical Details

12041090

Manufacturer

Congatec

Product type

Carrierboard

Formfactor

Proprietary

Architecture

x86

CPU

n.a.

Chipset io hub

n.a.

Memory (on board)

n.a.

Flash

n.a.

Operating temp. (low to high)

0 °C to 60 °C

eDP

up to 1

LVDS

up to 1

up to 3

Ethernet

up to 1

USB 2.0

up to 2

USB 3.0/3.1

up to 4

CAN

up to 1

RS232

up to 1

RS422

up to 1

RS485

up to 1

Outline dimensions (H→ x V↑)

294.0 x 244.0 mm

Downloads

Conga-TEVAL (1.1 MB) User's Guide for conga-TEVAL-COMe 3.0 (4.31 MB)

Accessories & Services

Accessories

Cooling solutions
Cables
Memory (on board)
HDD/SSD
Expansion modules
Carrier boards and baseboards

Services

Operating system support
Embedded computing design

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