Timeline Category
Milestone
Timline Text

In 2019, the range of bonding processes was expanded by the hybrid bonding process. Hybrid bonding combines the advantages of the LOCA and OCA and is suited for bonding touch sensors to glass as well as for bonding glass or touch sensors to displays. A perfect bonding method especially for touch glass display solutions with high volume requirements.

Timeline Media
Introduction of the hybrid bonding process
Contact
DATA MODUL Inc. Headquarters
Location address

275 Marcus Blvd
Unit R
Hauppauge, NY 11788
United States

Phone: +1 631 951 0800

Contact

For any questions, please feel free to contact us.
Please fill in the form and hit submit. If desired, we will get in touch with you within the next few days. Your contact data will be kept confidential.

You agree that we may store and process your data to answer your request. You can revoke your consent at any time by e-mail to datenschutz@data-modul.com or to the contact details given in the imprint. Incidentally, we refer to our privacy policy.