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Alongside previous bonding technologies such as AirGap, LOCA and OCA, DATA MODUL AG is now implementing the fourth process at the production location in Weikersheim: gel bonding.
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At Ortustech, it’s not just the TFT portfolio which is continuing to grow, but the panels themselves which are also growing in size.
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DATA MODUL started out the year somewhat modestly but business accelerated in the course of the first quarter.
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With the current Intel® Core™ platform, Coffee Lake H (eighth generation), having been officially launched, DATA MODUL can provide customers with samples of the corresponding COM Express Basic Type 6 modules.
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DATA MODUL supplies high-quality industrial monitors and panel PCs, developed and assembled in Germany. All the devices are for industrial use, available starting from small-scale production as entry-level products or for more demanding applications. The panels are designed for harsh ambient conditions indoors and outdoors and for 24/7 operation.
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